In late February, the Scalable Information Processing with Quantum Nano‑Photonics (SIPQNP) workshop, organised by MIT, brought together leading U.S. researchers in quantum photonics to discuss recent advances and to shape future research roadmaps in the field. The workshop covered a broad range of topics related to quantum photonic applications, with particular emphasis on the critical challenges of assembly and packaging of quantum photonic devices operating at cryogenic temperatures.

QPIC1550 was represented by partner Kamil Gradkowski (Tyndall National Institute), providing an opportunity to highlight key achievements of the project. In particular, discussions showcased QPIC1550’s progress in the design of a robust packaging process for silicon nitride (SiN) photonic integrated circuits capable of withstanding multiple cooldown cycles down to 10 K, enabling efficient single‑photon emission.

The workshop also offered a platform to present a broader vision for scaling the complexity and manufacturability of quantum photonic devices — an ambition that will be further explored within QPIC1550.