QPIC1550 Researchers Present SPAD Developments at ISSW2026

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QPIC1550 Researchers Present SPAD Developments at ISSW2026

QPIC1550 Researchers Present SPAD Developments at ISSW2026

QPIC1550 Researchers Present SPAD Developments at ISSW2026

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QPIC1550 Researchers Present SPAD Developments at ISSW2026

Early June in Seoul, South Korea, several partners from the QPIC1550 consortium will take part in the 2026 International SPAD Sensor Workshop (ISSW), now in its fifth edition. The workshop focuses on the study, modelling, design, fabrication, and characterisation of Single‑Photon Avalanche Diode (SPAD) sensors, bringing together researchers and practitioners working on advanced single‑photon detection technologies. 

QPIC1550 will be represented by Alberto Tosi, Simona Sorrentino, Fabio Telesca, Davide Orlandelli (POLIMI) and Stein Fakkel (TU/e).

QPIC1550 partners’ contributions

  • Alberto Tosi’s SPAD School lecture 

Alberto Tosi will deliver a lecture at the SPAD School on “Working principles and main parameters of InGaAs/InP SPADs.” While the lecture focuses on fundamentals, the QPIC1550 project will be mentioned as an example of future directions in the development of next‑generation InGaAs/InP detectors.

  • Poster: “On‑Chip Quenching Resistor for Multi‑Mesa InGaAs/InP SPAD without Additional Fabrication Step” 

Stein Fakkel will present a poster prepared with colleagues from TU/e and POLIMI, outlining recent progress within the QPIC1550 project on heterogeneous integration of InGaAs/InP SPADs with waveguides. The work includes the development of an on‑chip quenching resistor, a key element for improving detector performance in integrated photonic platforms.

  • Poster: “Hybrid Integration of InGaAs/InP Single‑Photon Avalanche Diodes with Si Photonic Platform”  

Simona Sorrentino, Kamil Gradkowski, Davide Orlandelli, Fabio Telesca, and Alberto Tosi (POLIMI and Tyndall National Institute) have submitted a poster titled “Hybrid Integration of InGaAs/InP Single‑Photon Avalanche Diodes with Si Photonic Platform.” The contribution presents ongoing work on hybrid integration of InGaAs/InP SPADs with silicon photonics, supporting the development of quantum photonic circuits operating at telecom wavelengths.

For more details, view the full ISSW program here.

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Funded by the EU

The QPIC 1550 project received funding from the European Union’s Horizon Europe Research and Innovation Programme under Grant Agreement No 101135785. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union. Neither the European Union nor the granting authority can be held responsible for them.

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