The 11th IEEE Electronics System-Integration Technology Conference (IEEE ESTC 2026) is the premier international event in the field of electronics packaging and system integration. The conference is organised every two years in Europe and is supported by IEEE-EPS in association with IMAPS Europe.
QPIC1550 partner Tyndall National Institute will present “Cryogenic Edge‑coupling Packaging Method of Photonic Chips using Annealed Adhesive.
